LOCTITE® ABLESTIK CE 3103WLV
Features and Benefits
Electrically conductive epoxy adhesive for stable contact resistance and a low-temperature cure. Offers a more secure electrical interconnection than traditional soldering.
This electrically conductive epoxy adhesive is a great lead-free alternative to solder, has stable contact resistance on non-noble terminated (Sn, SnPb, Ni, etc) components and substrates, and passes NASA outgassing standards, making it a great adhesive for all types of component assembly.
- Electrically conductive
- Low cure temperature
- Pb-free alternative to solder
- Stable contact resistance
Documents and Downloads
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Technical Information
Application method | Dispense gun |
Cure schedule, @ 120.0 °C | 10.0 min. |
Cure type | Heat cure |
Number of components | 1 part |
Operating temperature | 150.0 °C |
Physical form | Paste |
Recommended for use with | Metal: tin |
Shear strength | 1890.0 psi |
Storage temperature | -40.0 - -35.0 °C |
Thixotropic index | 5.5 |
Viscosity, Plate 2 cm @ 25.0 °C Shear Rate 15 s⁻¹ | 20000.0 mPa·s (cP) |
Volume resistivity | 0.0008 Ohm cm |