LOCTITE® ABLESTIK CE 3103WLV

Features and Benefits

Electrically conductive epoxy adhesive for stable contact resistance and a low-temperature cure. Offers a more secure electrical interconnection than traditional soldering.
This electrically conductive epoxy adhesive is a great lead-free alternative to solder, has stable contact resistance on non-noble terminated (Sn, SnPb, Ni, etc) components and substrates, and passes NASA outgassing standards, making it a great adhesive for all types of component assembly.
  • Electrically conductive
  • Low cure temperature
  • Pb-free alternative to solder
  • Stable contact resistance
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Technical Information

Application method Dispense gun
Cure schedule, @ 120.0 °C 10.0 min.
Cure type Heat cure
Number of components 1 part
Operating temperature 150.0 °C
Physical form Paste
Recommended for use with Metal: tin
Shear strength 1890.0 psi
Storage temperature -40.0 - -35.0 °C
Thixotropic index 5.5
Viscosity, Plate 2 cm @ 25.0 °C Shear Rate 15 s⁻¹ 20000.0 mPa·s (cP)
Volume resistivity 0.0008 Ohm cm