BERGQUIST® GAP PAD® TGP 3500ULM
Známé jako Gap Pad® 3500ULM
Vlastnosti a výhody
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Technické informace
| Barva | Šedá |
| Hodnocení hořlavosti | V-0 |
| Provozní teplota | -60.0 - 200.0 °C |
| Standardní tloušťka | 0.508 - 3.175 mm |
| Tepelná vodivost | 3.5 W/mK |
| Typ přepravce | Jiné než sklolaminát, Skleněná vlákna |
| Youngův modul | 27.5 KPa (4.0 psi ) |
BERGQUIST® GAP PAD® TGP 3500ULM
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).