Blog: Flexibility for Medical Device Design

When joining flexible parts with rigid parts, peel stresses are present at the joint, as the dissimilar materials react differently to the loads applied. How do you know how much stress will make your device fail? And how do you know if failure will happen at the bond line? Target is to achieve a joint stress far above the  requirements set by the related device standard.

Part size, flexibility, bond line geometries or material combination limit some of the assembly processes options. For example, it is difficult to use mechanical fasteners on tiny components or flexible materials cannot be joined by Ultrasonic Welding, or the majority of materials – including many newer substrates like TPE and TPU – show limitations when attempting solvent welding. 

In an industry challenged to manufacture highest quality components at lowest possible cost, light cure adhesives represent a great opportunity to lower manufacturing costs. With such adhesives you will eliminate work-in-progress inventories and speed your production time.

How Adhesive Bonding Enables Miniaturization in Medical Device Design