BERGQUIST® GAP FILLER TGF 3000SF
Features and Benefits
A blue, 2-part, silicone-free gap filler for high-throughput assembly applications.
BERGQUIST® GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler for thermal management on high-throughput, silicone-sensitive assembly applications such as power storage devices and charging equipment. After mixing, this blue gap filler maintains low compression stress during assembly, cures at room temperature and offers 3.0 W/m-K thermal conductivity.
- Silicone-free
- Service/operating temperature: -40°C to 100°C (-40°F to 212°F)
- Room temperature curing
- High thermal conductivity
Documents and Downloads
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Additional Documents
BERGQUIST® GAP FILLER TGF 3000SF
A blue, 2-part, silicone-free gap filler for high-throughput assembly applications.