Thermal Management Solutions for Ultra-Thin Bond Lines
With our expert Shelby Shevik
In the world of electronic devices, managing heat efficiently is crucial to ensuring optimal performance and longevity. Thermal Interface Materials (TIMs) play a vital role in achieving this goal by facilitating the transfer of heat from heat-generating components to heat sinks or spreaders. Striking the right balance between thinness and thickness is essential for TIMs, as they must be as thin as possible to minimize thermal resistance while also being thick enough to eliminate air gaps. In this podcast episode, our expert delves into the considerations for ultra-thin bond line TIMs, exploring the advantages and challenges of phase change TIMs and thermal greases and shedding light on their crucial role in the ever-evolving landscape of electronic devices.
