LOCTITE® ABLESTIK CT 5047-2

Merkmale und Vorteile

Low-temperature cure adhesive designed to make electrical connections where hot soldering is impractical, or to conductive plastics where high temperatures aren’t possible.
When you need an electrically conductive adhesive but can’t subject your assembly to heat, try LOCTITE® ABLESTIK CT 5047-2. This low-temperature cure, high bond-strength adhesive is perfect for making electrical connections where hot soldering is impractical, or to conductive plastics when you can’t subject them to high temperatures. You can rely on an operating temperature of -40°C to 130°C (-40°F to 266°F).
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Technische Informationen

Anzahl Komponenten 2K
Aushärtetechnik Aushärtung durch Wärme
Aushärtezyklus, @ 65.0 °C 2.0 h
Betriebstemperatur -40.0 - 130.0 °C
Lagertemperatur 25.0 °C
Scherfestigkeit, Aluminium 1000.0 psi
Volumenwiderstand, Cured 24 hours @ 25 °C 0.002 Ohm cm