Henkel's Web-Seminar with ZFW & bdtronic on New High-Performance Liquid Gap Filler with 7 W/mK
Learn about Henkel's newest Thermal Interface Material (TIM), its design rules and tailored process technology for automated mass production
To save valuable space inside vehicle designs, engineers are constantly seeking to miniaturize components, including power electronics such as inverters and on-board chargers. At the same time, power electronics are not only becoming smaller, but also more powerful, as proven by next-generation ADAS systems. Both trends are making thermal management an even higher priority as larger amounts of heat are being released while less surface area is available to act as a heat sink.
Recognizing this market trend towards small-sized, high power density automotive electronics, Henkel developed a new liquid Gap Filler technology that is able to dissipate heat with an unchallenged 7 W/mK. In addition, with a dispense of rate of up to 18 g/sec, the material is also suitable for mass production.
During this web-seminar, our speakers from Henkel, ZFW (Zentrum für Wärmemanagement) and bdtronic (Dispensing Systems) provide:
- An introduction to the BERGQUIST TGF7000 (liquid Gap Filler with 7 W/mK), the design considerations and building blocks to reach up to 18 g/sec dispense rate (Henkel)
- An overview of the testing methods, failure mechanisms and design rules, as well as an application thereof to TGF7000 (ZFW)
- An understanding of how to enable fully automated taylored dispensing technology or large-scale production (bdtronic)
Join our speakers Stephan Hoefer (Henkel), Holger Schuh (Henkel), Florian Schütz (bdtronic) and Robert Liebchen (ZFW) to learn more about this innovation.
