LOCTITE® ABLESTIK 6202C-X
Features and Benefits
This B-stageable adhesive is ideal for chip-scale packages and stencil printing, especially on laminate-based packages where tolerance and bleed must be minimized.
LOCTITE® ABLESTIK 6202C-X is a yellow, b-stageable die-attach adhesive perfect for laminate-based packages where tolerance and bleed must be minimized. It has a long work life, low moisture uptake, low flow (<150µm), low warpage and low modulus, making it ideal for large die sizes. LOCTITE ABLESTIK 6202C-X is designed with a proprietary hybrid chemistry technology and cures when exposed to heat.
- Designed for stencil printing
- Low modulus
- Offers a long work life
- Low flow and low moisture uptake
- Low warpage
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 70.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 232.0 ppm/°C |
| Cure type | Heat cure |
| Density, Maximum Final | 1.1 g/cm³ |
| Extractable ionic content, Chloride (CI-) | 25.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 25.0 ppm |
| Glass transition temperature (Tg) | 40.0 °C |
| Hot die shear strength | 1.0 kg-f |
| RT die shear strength | 10.0 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 6.0 N/mm² (812.0 psi ) |
| Thixotropic index | 2.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 30000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 6202C-X
This B-stageable adhesive is ideal for chip-scale packages and stencil printing, especially on laminate-based packages where tolerance and bleed must be minimized.