LOCTITE^® Solder Game Changer Portfolio

Henkel's game changing solder materials

Simple, Scalable and Temperature Stable

The LOCTITE^® GC solder paste platform changes everything you thought you knew about solder. Uniquely stable flux chemistry delivers unprecedented performance and is the basis of all LOCTITE^® GC materials, including the award-winning LOCTITE^® GC 10 and water-washable LOCTITE^® GC 3W.

The Anatomy of a Game Changer

LOCTITE^® GC 10 is stable at 26.5°C for one year and at temperatures of up to 40°C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.

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Illustration of all benefits of the Henkel Solder Game Changer Portfolio

Improved Stability

The material and temperature stability of the LOCTITE^® GC line ensures superior batch-to-batch consistency (12x over conventional paste solutions), resulting in finer on-line stencil stability.

Improved Printing

The single flux formulation not only reduces printing defects, but it is designed to meet all assembly needs. From challenging miniaturized components for handheld products to high-reliability devices for automotive applications, GC offers the best paste transfer efficiency and paste-on-pad material volumes.

Improved Reflow

Eliminating the need for expensive nitrogen reflow, LOCTITE^® GC pastes have superb coalescence in air on 0201, 01005 and 0.03 mm CSP components, and show zero dewetting on a long hot soak profile, with a minimal hot slump at 182°C.

Improved Logistics - Transport

Illustrated green icon of a logistics unit with the words improved logistics

Offering a truly adaptable and flexible solder paste supply chain, the LOCTITE^® GC portfolio reduces concern about receiving-to-refrigeration speed, ensuring a cost-effective transport, production and operating lifecycle.

Cost Savings

The LOCTITE^® GC line offers a solder paste that works for all board sizes, densities, thicknesses and surface finishes—eliminate costly NPI evaluations by qualifying one material for all assembly requirements.

Sustainability

Compliant with REACH halogen-free initiatives, GC solder pastes are a halogen-free formula, they also integrate RoHS and EICC conflict-free tin sourcing practices. The LOCTITE^® GC program pushes sustainability even further by eliminating nitrogen, reducing energy usage, and maximizing productivity and yield.

Optimized Paste Management

Illustrated green icon of a paste management unit with the words improved paste management

Not only does LOCTITE^® GC eliminate end-of-day paste scrapping to 5%, compared to an industry standard of 25%, but the room temperature stable formula ensures more use on the line and less paste in the bin.

No Refrigeration

Sustainable energy consumption is part of shipping and storing the no-refrigeration-required LOCTITE^® GC products. With no thaw period required prior to production use, time on the line starts as soon as the paste is placed in production.

Customer Testimonials

With the launch of the LOCTITE^® GC platform, Henkel has forever changed the game and the way the industry thinks about and uses solder paste. Our customers have an advantage, and they’re enthusiastically talking about it.

"We have always had issues with paste drying out prematurely and clogging fine-pitch apertures, even during the course of a daily production run. Because of the fine-pitch, high density nature and the reliability requirements of the products we are producing, re-using paste has always been out of the question. Because of this, we expect to discard a minimum of 1/3 of the unused paste of every jar we open.

LOCTITE^® GC 10 has completely changed our traditional working models. The paste has given us nothing but perfect, consistent results with no refrigeration. In our evaluation, LOCTITE^® GC 10 came out of the jar perfect and the printing results at 60 hours were just as good as they were an hour after opening the jar. It printed and reflowed perfectly and we achieved very close to 100% yield. In addition, we didn't experience any aperture clogging, the stencil cleaned up easily and the paste didn't dry out. The cost savings for our business are substantial and far outweigh any incremental cost differential versus competitive pastes. LOCTITE^® GC 10 is absolutely the "game changer" it claims to be!"

"Our company has recently entered a field where high-mix, low volume production is the norm and demand is very dynamic. Thanks to LOCTITE^® 10's temperature stability, long shelf life and simplified storage capability, we don't have to worry about the performance of our solder paste being compromised, even when demand levels change."

"Outside of its excellent process performance, which is always our top priority, the sheer simplicity and cost savings realized by LOCTITE^® GC 10's hasH2e-free material management are incredible. There is no taking it out of the refrigerator hours before a shift, no complex labeling and, best of all, start-up time is zero. We just take it off the shelf, put it on the stencil and start printing boards. We've left LOCTITE^® GC 10 on the stencil for more than eight hours and it was as creamy as when we first opened the jar - no kneading required. Plus, we can do away with expensive overnight shipping of solder paste and worry about temperature explosure. With LOCTITE^® GC 10, we have a lot more latitude and that translates to more efficient operations."

"Our initial evaluation fo the new Henkel LOCTITE^® temerature stable solder paste yielded great results. We were able to hold jobs on the line for as long as two days and had absolutely excellent reflow performance even though the paste has been exposed for an extended period of time. This capability completely eliminates any guesswork as to wheather or not the material is still usable - it is! The paste also prints well and, given its projected online utilization, we anticipate that we will significantly reduce paste waste while realizing excellent process performance."

"We observed high consistency on printability and shiny solder joints after reflow with LOCTITE^® GC 10. What makes us interested in this product is that it does not require and thawing time before usage. We are currently evaluating the solder paste's abandon time, stencil life and printing consistency within continuous production runs and are interested in the results."

"The idea to develop a temperature - stable solder paste was conceived as a way to expand the technical capabilities of solder and utilize chemistries that were considered unsuitable for solder pastes due to their inherent reactivity. To achieve not only a temperature - stable solder paste, but a product that delivers exceptional performance on all levels, has taken approximately four years, involved more than 10 members of the R&D team, and well over 1,000 formulation iterations to reach this successful conclusion and deliver this game-changing technology."

"We were one of the early adopters of LOCTITE^® GC 10 and our initial great results have continued. We have consistently experienced fantastic performance and, in fact, have recommended the material to other companies who are equally as impressed with LOCTITE^® GC 10. The ability to reuse the material without scrapping remaining paste at the end of a shift has paid big dividends. By our estimates, we've saved as much as 50% on overall solder paste costs versus previous materials. LOCTITE^® GC 10 has exceeded expectations!"

Resources for Solder Materials

Brochure: Solder Material Solutions

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LOCTITE^® Solder Game Changer Portfolio

Simple, Scalable and Temperature Stable