Henkel Showcases Latest Adhesive Technologies Solutions at SEMICON Europa
New solutions for advanced semiconductor packaging, automotive and industrial electronics applications
Düsseldorf, Germany – As an event designed to attract visitors from across the European microelectronics landscape, SEMICON Europa’s technical focus is uniquely aligned with Henkel’s broad range of semiconductor packaging solutions. The company’s material portfolio including die attach, underfills, and EMI shielding formulations for MEMS, LEDs, RF and power devices, CMOS, and image sensors will be on display at booth A4661 at the European Conference and Exhibition, set to take place from November 13 to 16 in Munich, Germany.
This year’s show is co-hosted with Electronica 2018, offering an opportunity for Henkel to share its electronics assembly solutions for the industrial as well as automotive markets. Among the broad range of materials at the Henkel booth will be technologies that enable E-mobility, powertrain, ADAS, chassis, interior, and lighting systems in the automotive space; as well as power supply, industrial automation, alternative energy, and telecom applications for the industrial sector.
In addition to advanced electronic materials, a partnership with Henkel provides access to the company’s deep technical knowhow, broad global support network, and state-of-the-art R&D capabilities. During SEMICON Europa, visitors can learn from Henkel experts during two paper presentations:
- Tuesday, November 13 at 14:45 – Henkel EIMEA Semiconductor Steering Unit Head, Ruud de Wit, will present a paper entitled “Adhesive & Encapsulation Developments for Advanced Semiconductor Packaging”. Mr. de Wit’s technical session focuses on materials that enable advanced semiconductor packaging designs such as fan-in and fan-out wafer-level packaging (WLP), 2.5D/3D stacking and through silicon vias (TSVs).
- Wednesday, November 14 at 12:30 – “Innovative Adhesives for Next-Generation Sensing Modules” is the topic of the presentation from Henkel’s Kily Wu, Product Development Manager. Sensing modules are critical to today’s “smart” technologies such as camera modules, ambient light sensors, biometric sensors, and MEMS devices. Signal sensing and processing capabilities are largely dependent on the adhesives used to construct today’s sensors and Mr. Wu’s paper will address performance criteria and material selection considerations.
Henkel’s comprehensive product portfolio is unmatched in the semiconductor packaging and electronics assembly markets. Henkel offers materials that make advanced devices possible by facilitating strong bonds, robust electrical connections, durable device protection and reliability-enhancing thermal control. Visitors at SEMICON Europa and Electronica 2018 can learn more about the company’s latest die attach adhesives, solders, underfills, liquid encapsulants, thermal interface materials, EMI shielding solutions and more. For information about all of Henkel’s innovative technologies come to booth A4661 at SEMICON Europa.