LOCTITE® ABLESTIK 526W01
Features and Benefits
LOCTITE ABLESTIK 526W01, Epoxy, Assembly
LOCTITE® ABLESTIK 526W01 is designed to protect wire bonds and bare die. This material has also been tested to withstand multiple exposures to 260 °C reflow.
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Technical Information
| Cure schedule, @ 150.0 °C | 45.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Operating temperature | -50.0 - 260.0 °C |
| Recommended for use with | Ceramic |
| Storage temperature | 27.0 °C |
| Viscosity, Brookfield CP52, @ 25.0 °C Speed 1 rpm | 400000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 526W01
LOCTITE ABLESTIK 526W01, Epoxy, Assembly