LOCTITE® ECCOBOND DS 3318BLX

Merkmale und Vorteile

LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation
LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing.
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Technische Informationen

Anwendungen Verkapselung
Aushärtetechnik UV-Aushärtung
Bruchdehnung 250.0 %
Farbe Blau
Glasübergangstemperatur (Tg) 68.0 °C
Lagertemperatur 25.0 °C
Speichermodul, @ 25.0 °C 510.0 MPa
Viskosität, Cone 20 mm, Angle 2° @ 25.0 °C Spindle TA, Shear Rate 15 s⁻¹ 2050.0 mPa.s (cP)