Elevated operational temperature is a key factor influencing die performance, so thorough heat dissipation helps ensure functional execution and long-term reliability. Henkel’s Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur, explains the mechanism of heat transfer from the die and why material selection is critical: “For most high-power semiconductor packages, the primary path for heat dissipation from the device is through the die attach material. Because the material is in direct contact with the die, its thermal characteristics – which include material thickness, thermal conductivity, and thermal resistance – are the most important. Loctite Ablestik 6395T’s 30 W/m-K bulk thermal conductivity provides excellent heat transfer for metalized or bare Si die.”
Most high-power semiconductor applications, like those found in electric vehicles, industrial automation systems, and 5G infrastructure components, also demand good electrical conductivity. Too much electrical resistance between the die and the package can result in energy loss and reduce the device’s energy efficiency. As in the case of thermal capabilities, package electrical performance is largely influenced by the die attach layer – especially in power ICs, where die attach is the most significant contributor to electrical resistance, or RDS (on). Loctite Ablestik 6395T improves energy efficiency by significantly lowering resistance.
