LOCTITE® ABLESTIK 27

Features and Benefits

TDS Download
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive
LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure schedules.
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Documents and Downloads

Technical Data Sheet
LOCTITE® ABLESTIK 27
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Technical Information

Cure schedule, Recommended @ 95.0 °C 1.0 hr.
Cure type Room temperature (ambient) cure
Number of components 2 part
Physical form Liquid
Recommended for use with Metal
Shear strength, Aluminium 4500.0 psi
Storage temperature 25.0 °C
Resin
Viscosity, Brookfield, Resin 7500.0 mPa·s (cP)
Hardener
Viscosity, Brookfield, Hardener 35.0 mPa·s (cP)