Optical switches are essential components of today’s high-speed, dynamically-reconfigurable networks and data center interconnect applications, allowing high signal switching speeds for large amounts of data. In order to function at maximum capacity, optical switches require maximum light transmittance for minimized signal loss. Much of the switch performance is dependent upon assembly precision and material durability, which is why Henkel materials are preferred for these applications.
Material Solutions for High Performance Optical Switch Applications
Optical Switch Applications
ROADM
enGap Pad®
Low modulus, high thermal conductivity, silicone-free BERGQUIST GAP PAD® are highly conformable, provide low assembly stress and optimize thermal performance for ICs in optical components and devices.
BERGQUIST GAP PAD® TGP EMI1000(1W/mK)
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3004SF (3W/mK)
BERGQUIST GAP PAD® TGP 3000ULM (3W/mK)
BERGQUIST GAP PAD® TGP 3500ULM (3.5W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® 3517M
LOCTITE® ECCOBOND UF 3812
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low compx/oneweb/master/en/industries/telecom-datacom-infrastructure/wireless-connectivity-mobile-and-fixed/wireless-mobile-access-5g.htmlonent stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
LOCTITE® 315 (0.8W/mK)
LOCTITE® 3875 (1.75W/mK)
BERGQUIST® LIQUI-FORM TLF LF3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
Wavelength Selective Switch
enOptical Sub-Assembly (OSA)
- Active Alignment & Bonding Adhesives
- Backfill Adhesives
Active Alignment and Bonding Adhesives:
An optimized active optical alignment process enables highly accurate and cost-effective production of optical sub-assemblies (TOSA, ROSA) in optical transceivers. Henkel’s dual-cure UV adhesives are designed to precisely align these optical components by providing low shrinkage, low CTE, good light transmittance, high reliability and improved dispensing life.
LOCTITE® ECCOBOND LUX AA50T
LOCTITE® ECCOBOND LUX 3042M
LOCTITE® HHD 4042
Backfill Adhesives:
LOCTITE brand backfill adhesives are designed to encapsulate, protect and provide a structural bond for optoelectronics applications. These materials compliment the use active alignment products in optical sub assembly (TOSA, ROSA). The combined use of dual UV cure adhesives for active alignment and backfill adhesives provide a highly reliable alignment which can withstand changes in temperature and humidity.
LOCTITE ABLESTIK BF 4
LOCTITE STYCAST OS 8301
LOCTITE ABLESTIK FS 245
Phase Change Materials
Henkel Phase Change Materials offer a combination of grease-like thermal performance with pad like convenience when used between components and heatsinks in Optical Switch, ROADM and WSS devices. Above the phase change temperature BERQUIST PCM wets-out the thermal interface surface and flows to produce low thermal impedance for efficient removal of heat to support improved device performance and reliability.
LOCTITE® TCP 4000 D (3.4W/mK)
BERGQUIST® HI-FLOW THF 1600G (1.6W/mK)
Gasketing Materials
LOCTITE one-component silicone gasketing and sealing products allow for load bearing and shock absorption at the bond location. The materials are designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework in optoelectronics applications.
LOCTITE® SI 5421
LOCTITE® ABLESTIK 59C
LOCTITE SI 5084
LOCTITE SI 5210
Thermal Gel
LOCTITE® thermal adhesives are designed to provide excellent heat dissipation for thermally-sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application specific requirements and ease-of-use.
LOCTITE® 315 (0.8W/mK)
LOCTITE® 3875 (1.75W/mK)
BERGQUIST® LIQUI-FORM TLF LF3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® 3517M
LOCTITE® ECCOBOND UF 3812
Fiber Array Unit
- Structural Adhesives
- V-Groove Bonding Material
- Optical Path Adhesives
LOCTITE® ECCOBOND® light path adhesives deliver wicking capability with low viscosity, good adhesion to fiber and silicon/glass, matched refractive index (RI) and good damp heat performance in v-groove bonding in fiber arrays.
Fiber Assembly Adhesive
Fiber optic cable assembles require proper termination for optimum light transmission efficiency and minimal data loss. Henkel provides unmatched bonding solutions for fiber assembly applications including fiber coupling/ tacking, fiber splicing, fiber to ferule attach, fiber connector bonding and pig tail bonding. Henkel’s epoxy adhesive formulations bond well to most substrates including glass, plastic, stainless steel and ceramics to ensure limited fiber displacement and mitigate interference from mechanical and thermal factors. Henkel also offers dual-cure (UV/thermal), thermal cure and room temperature cure adhesives to help maintain the integrity of fiber alignment as well as protect heat-sensitive materials in the fiber optic assembly.
Gap Pad®
Low modulus, high thermal conductivity, silicone-free BERGQUIST GAP PAD® are highly conformable, provide low assembly stress and optimize thermal performance for ICs in optical components and devices.
BERGQUIST GAP PAD® TGP EMI1000(1W/mK)
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3004SF (3W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
FPC Bonding Adhesives
Flexible printed circuit (FPC) boding adhesives are ideal for photonic applications that require a flexible joint. Strong adhesion to many substrates, thixotropic for minimal migration and compliant for excellent shock absorption, LOCTITE FPC bonding adhesives are available in a variety of curing profiles.
LOCTITE® 3128
LOCTITE® ABLESTIK 2170
LOCTITE® 3703
LOCTITE® AA 190024
Die-Attach Adhesives
LOCTITE® ABLESTIK® one-component, low-bleed, low-outgassing, high-performance, high-reliability conductive die attach adhesives and semi-sintering materials are ideal for laser diode bonding.
LOCTITE® ABLESTIK 8068TA
LOCTITE® ABLESTIK 84-1LMI
LOCTITE® ABLESTIK 8910T
LOCTITE® ABLESTIK 2030SC
LOCTITE® ABLESTIK 8068TB
LOCTITE® ABLESTIK 84-1LMISR4
LOCTITE® ABLESTIK 84-3
Laser Diode Bonding
Laser diodes are found throughout fiber optic communication devices including optical switches. Reliably bonding the laser diodes is achieved with Henkel die attach adhesives, which include traditional and high thermal semi-sintering materials.
Fiber Array Unit (FAU) Assembly
Fiber array units -- comprised of optical fibers, a V-groove chip and cover assembly -- provide photonic integrated chip connections for long-haul, metro and datacenter applications. Henkel LOCTITE® V-groove adhesives hold optical fibers into individual pathways, while structural adhesives reliably bond the fiber array to the assembly. Other adhesive solutions include optically clear light path materials optimized for minimized signal loss, and active alignment adhesives that precisely secure the assembly along the light path. As a system, all of these materials are integral to the precision performance of the FAU.
Fiber Bonding
Fiber optic cables require proper termination for transmission efficiency and minimal data loss. Within the switch application, there are many fiber bonding requirements, including: bonding and sealing fibers/fiber bundles into a ferrule, bonding optical fiber into connectors, potting fiber bundles and bonding of V-groove arrays. As the world’s leading adhesives supplier, Henkel’s bonding solutions are renowned for exceptional quality and reliable performance. Epoxy adhesives bond well to most substrates including glass, stainless steel, and ceramics to ensure limited fiber displacement and mitigate interference from mechanical and thermal factors. In addition, Henkel’s dual-cure (UV/thermal), thermal cure and room temperature cure adhesives to help maintain the integrity of fiber alignment and protect heat-sensitive materials in the fiber optic assembly.
Thermal Management
Controlling operational heat is key to improving system-level performance and in-field reliability of power optical switch applications including the ROADM/WSS. Effective thermal management is achieved through the use of high performance thermal interface materials (TIMs) that dissipate heat from its source to a heat absorbing device. Satisfying various application and processing preferences, Henkel has a wide range of thermal interface material (TIM) solutions in various formats including pads, liquids, gels and phase change TIMs.
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