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      • A packshot of BERGUIST microTIM mTIM 1013 showing a heat sink with a tan microTIM film.

        Thermally conductive films

        BERGQUIST® microTIM mTIM 1013

        Durable micro-thermal interface coating for pluggable optical modules
      • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP Q2000

        Electrically conductive fibreglass-reinforced pad - withstands processing stress
      • Packshot for black adhesive of LOCTITE ABLESTIK TE 3530 in 3cc, 5cc, 10cc, 30cc

        Thermally conductive adhesives

        LOCTITE® ABLESTIK TE 3530

        Thermally conductive epoxy adhesive for heat dissipation components
      • A packshot of BERGQUIST GAP PAD TGP 3000ULM showing a grey gap pad.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP 3000ULM

        Soft, fiberglass reinforced, electrically insulating pad
      • This is a group packshot for BERGQUIST LIQUI FORM TLF 3500CGEL

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 3500CGEL

        Highly thermally conductive gel for demanding applications
      • A packshot of BERGQUIST SIL PAD TSP 1600 showing gold sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 1600

        Electrically insulating pad - highly compliant soft material
      • A packshot of BERGQUIST GAP FILLER TGF 1400SL showing yellow and white 50CC, 200CC, and 400CC kits.

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 1400SL

        Self-leveling, injectable, thermally conductive liquid
      • A packshot of BERGQUIST GAP PAD TGP 2000 showing grey sheets and die cuts.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP 2000

        Thermally conductive, reinforced pad for low-stress applications 
      • A packshot of BERGQUIST HI FLOW THF 1600G showing green sheets, die cuts, and die cut roll.

        Phase change materials

        BERGQUIST® HI FLOW THF 1600G

        Electrically insulating reinforced pad
      • packshot for black gap pad material BERGQUIST GAP PAD TGP EMI 4000

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP EMI 4000

        Multifunctional gap pad for electromagnetic radiation absorption
      • Packshot for BERGQUIST GAP FILLER TGF 4400LVO, part a and part b pail

        Thermal gap fillers

        BERGQUIST® GAP FILLER TGF 4400LVO

        Next generation gap filler for electronic assembly applications
      • A packshot of BERGQUIST GAP PAD TGP 5000 showing light green sheets and die cuts.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP 5000

        Soft, fiberglass-reinforced insulation pad - high performance

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