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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Part no. (SKU/IDH):
2624519

IDH Name:
BERGQUIST® LIQUI FORM TLF 6000HG, 150 ml Dual cartridge

Thermal gels

BERGQUIST® LIQUI FORM TLF 6000HG

For telecom market applications requiring high gap fill

This 1-part, gray, silicone-based, fully cured thermal interface gel is specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.

Marketing materials

Part no. (SKU/IDH):
2624519

IDH Name:
BERGQUIST® LIQUI FORM TLF 6000HG, 150 ml Dual cartridge

Part no. (SKU/IDH) 2624519
BERGQUIST® LIQUI FORM TLF 6000HG, 150 ml Dual cartridge

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

BERGQUIST® LIQUI FORM TLF 6000HG is an award-winning, thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0 mm (0.11"), delivering robust vertical gap stability.

Please contact us for ordering options

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