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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3500ULM
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Soft, fiberglass reinforced, electrically insulating pad
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA2000
Dispensable liquid adhesive for structural component bonding
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2500
Electrically conductive, aluminum-foil-reinforced pad - maximum heat transfer
BERGQUIST® GAP PAD® TGP 7000ULM
Extremely soft, high performance electrically insulating pad
BERGQUIST® SIL PAD® TSP 1800
Electrically insulating, fibreglass-reinforced - exceptional performance
Thermal gap fillers
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
Phase change materials
BERGQUIST® HI FLOW THF 1600P
High performance, electrically insulating, reinforced pad
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
LOCTITE® TLB 9300 APSi
High bond strength, thermally conductive, electrically insulating adhesive
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
BERGQUIST® GAP PAD® TGP HC5000
Soft, fiberglass-reinforced insulation pad - high-performance
