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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
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Soft, fiberglass reinforced, electrically insulating pad
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
BERGQUIST® SIL PAD® TSP 1600
Electrically insulating pad - highly compliant soft material
Thermal gels
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
BERGQUIST® GAP FILLER TGF 1450
Versatile, cost-effective dispensable liquid
Phase change materials
BERGQUIST® HI FLOW THF 1600G
Electrically insulating reinforced pad
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced pad for low-stress applications
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption