Film adhesives
Film adhesive for electrical, thermal and mechanical assembly applications
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK CF 3350 is a silver-filled flexible film adhesive with high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
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Uniform bondline adhesion
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High thermal and electrical conductivity
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Silver-filled
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Minimum thermal resistance to heat sink
- Product category:
- Film adhesives
Technologies:
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Thermosets, electronics assembly materials
- Cure schedule, @ 150.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Physical form:
- Film
- Thermal conductivity:
- 7.0 W/mK
