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Henkel Adhesive Technologies
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
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Durable micro-thermal interface coating for pluggable optical modules
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad
Thermal gels
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
BERGQUIST® LIQUI BOND TLB SA2005RT
Dispensable liquid for structural component bonding - high performance
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable pad combining thermal dissipation and EMI absorption
BERGQUIST® LIQUI FORM TLF 6500CGEL-SF
Silicone-free, post-cure gel for automotive electronics
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
BERGQUIST® LIQUI FORM TLF LF3500
For demanding, stay-in-place applications
Phase change materials
LOCTITE® TCP 4000D
Dispensable paste - low thermal impedance
BERGQUIST® SIL PAD® TSP 1600
Electrically insulating pad - highly compliant soft material
