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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
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Soft, fiberglass reinforced, electrically insulating pad
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
BERGQUIST® GAP PAD® TGP 3004SF
Soft, electrically insulating pad - silicone free
Thermal gels
BERGQUIST® LIQUI FORM TLF 3800LVO
For silicone-sensitive applications
BERGQUIST® GAP PAD® TGP 2400
Soft, fibreglass-reinforced insulation pad - low stress applications
BERGQUIST® SIL PAD® TSP 1800
Electrically insulating, fibreglass-reinforced - exceptional performance
BERGQUIST® LIQUI BOND TLB SA2000
Dispensable liquid adhesive for structural component bonding
BERGQUIST® SIL PAD® TSP Q2500
Electrically conductive, aluminum-foil-reinforced pad - maximum heat transfer
BERGQUIST® BOND PLY TBP 1400LMS-HD
Flexible, laminated material for structural component bonding
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid