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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
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Soft, fiberglass reinforced, electrically insulating pad
BERGQUIST® GAP PAD® TGP 5000
Soft, fiberglass-reinforced insulation pad - high performance
Thermally conductive adhesives
LOCTITE® ABLESTIK QMI529HT
Electrically conductive die-attach adhesive for high-reliability package applications
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
LOCTITE® TLB 9300 APSi
High bond strength, thermally conductive, electrically insulating adhesive
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
BERGQUIST® GAP PAD® TGP HC5000
Soft, fiberglass-reinforced insulation pad - high-performance
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
BERGQUIST® GAP PAD® TGP 3004SF
Soft, electrically insulating pad - silicone free
Thermal gels
BERGQUIST® LIQUI FORM TLF 3800LVO
For silicone-sensitive applications
BERGQUIST® GAP PAD® TGP 2400
Soft, fibreglass-reinforced insulation pad - low stress applications