LOCTITE® ABLESTIK 550K
Known as Ablestik ABLEFILM 550K
Features and Benefits
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly
LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding
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Documents and Downloads
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Technical Information
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 5.7 |
| Glass transition temperature (Tg) | 102.0 °C |
| Physical form | Film |
| Shear strength, Aluminium | 3300.0 psi |
| Thermal conductivity | 0.8 W/mK |
LOCTITE® ABLESTIK 550K
LOCTITE ABLESTIK 550K, Epoxy Film, Assembly