LOCTITE® STYCAST S 5225
Features and Benefits
LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating
LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features primerless adhesion when heat cured thus using fewer processing steps than materials that require the use of a surface primer. LOCTITE STYCAST S 5225 is tested to conform with the requirements of UL 94 V-0 flammability standard to 6.35mm thickness.
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Technical Information
| Applications | Encapsulating |
| Cure schedule, @ 25.0 °C | 16.0 hr. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | -120.0 °C |
| Mix ratio, by volume | 100 : 100 |
| Mix ratio, by weight | 100 : 100 |
| Number of components | 2 part |
| Shelf life | 180.0 day |
| Shore hardness, Shore A | 53.0 |
| Mixed | |
| Colour, Mixed | Grey |
| Viscosity, Brookfield, Mixed @ 25.0 °C Speed 50 rpm | 2420.0 mPa·s (cP) |
| Resin | |
| Colour, Resin | Off white |
| Viscosity, Brookfield, Resin @ 25.0 °C Speed 50 rpm | 2230.0 mPa·s (cP) |
| Hardener | |
| Colour, Hardener | Black |
| Viscosity, Brookfield, Hardener @ 25.0 °C Speed 50 rpm | 2550.0 mPa·s (cP) |
LOCTITE® STYCAST S 5225
LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating