LOCTITE® ABLESTIK NCA 2340

Features and Benefits

LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive
LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 61.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 83.0 °C
Thixotropic index 5.3
Viscosity, Brookfield, Shear Rate 10 s⁻¹ 35000.0 mPa·s (cP)