LOCTITE® ABLESTIK 564A

Known as Ablestik ABLEFILM ECF564A

Features and Benefits

LOCTITE ABLESTIK 564A, Epoxy Film, Assembly
LOCTITE® ABLESTIK 564A adhesive film is designed for bonding hybrid substrates into packages. In centrifuge tests, this adhesive passed 15,000 gs.
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Technical Information

Agency approvals / certificates / specifications MIL standard 883 (method 5011)
Cure schedule, @ 150.0 °C 2.0 hr.
Cure type Heat cure
Dielectric constant, @ 1kHz 4.02
Glass transition temperature (Tg) 140.0 °C
Physical form Film
Shear strength, Aluminium 3800.0 psi
Thermal conductivity 0.3 W/mK