Thermal Materials for Packaging Power Electronics

INTRODUCTION

Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM). Traditionally used thermal greases provide good end of line performance but they can degrade. Several alternatives and advances have now expanded that choice to a wide variety of product families. TIMs come in a wide variety of properties, physical formats and automation readiness to suit the wide variety of applications. Additionally, TIMs may be tasked with insulation reliability, adhesion, and encapsulation. 

Thermal interface materials come in a variety of formats and performance attributes – the selection depends on the thermal and electrical insulation needs. In addition, one must consider manufacturability and automation in choosing the right TIM.