LOCTITE® ECCOBOND UF 3811
功能與優點
This halogen free, reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.
LOCTITE® ECCOBOND UF 3811 is a reworkable, low-viscosity epoxy underfill specially designed for CSP and BGA applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing.
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技術資訊
| 建議固化方式, @ 100.0 °C | 60.0 分 |
| 熱膨脹係數 (CTE), Above Tg | 190.0 ppm/°C |
| 熱膨脹係數 (CTE), Below Tg | 61.0 ppm/°C |
| 玻璃化溫度(Tg) | 124.0 °C |
| 粘度，Brookfield, Physica @ 25.0 °C Spindle CP50-1, Speed 20 rpm | 354.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3811
This halogen free, reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.