LOCTITE® ECCOBOND FP4530

Name: LOCTITE® ECCOBOND FP4530
Brand: LOCTITE

功能與優點

LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill

LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.

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技術資訊

建議固化方式, @ 160.0 °C	7.0 分
熱膨脹係數 (CTE), Above Tg	150.0 ppm/°C
熱膨脹係數 (CTE), Below Tg	46.0 ppm/°C
玻璃化溫度(Tg)	145.0 °C
粘度，Brookfield 錐型和板型, @ 25.0 °C Spindle 52, speed 20 rpm	3500.0 mPa.s (cP)