LOCTITE® ABLESTIK NCA 2340

功能與優點

LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive
LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.
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技術資訊

固化類型 熱固化
應用 晶片焊接
熱膨脹係數 (CTE) 61.0 ppm/°C
玻璃化溫度(Tg) 83.0 °C
粘度,Brookfield, Shear Rate 10 s⁻¹ 35000.0 mPa.s (cP)
觸變指數 5.3