LOCTITE® ABLESTIK 933-1
功能与优点
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant
LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
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技术信息
| 储存温度 | -40.0 °C |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 125.0 °C | 2.0 小时 |
| 应用 | 封装 |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 360500.0 mPa.s (cP) |
| 组分数量 | 单组份 |
LOCTITE® ABLESTIK 933-1
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant