BERGQUIST® GAP PAD® TGP HC1000
Poznano kot Gap Pad® HC1000
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BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material
BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
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Tehnične informacije
| Barva | Siva |
| Delovna temperatura | -60.0 - 200.0 °C |
| Ocena plamena | V-0 |
| Standardna debelina | 0.254 - 0.508 mm |
| Toplotna prevodnost | 0.1 W/mK |
| Vrsta nosilca | Steklena vlakna |
| Youngovi moduli, ASTM D575 | 275.0 KPa (40.0 psi ) |
BERGQUIST® GAP PAD® TGP HC1000
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material