Best-in-class thermal performance

Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with material solutions from Henkel. As a total solutions provider, Henkel not only leverages its extensive global coverage and manufacturing network to deliver superior technologies, but ensures regional support for its customers with customized solutions. With our long standing expertise, we deliver a broad technology tool box and application know-how including resin and filler technology.

Smaller, higher functioning devices within applications in various market sectors are increasing power densities and driving the need for more effective heat dissipation. While thermal interface materials offer this capability at the board and component level, more user-friendly and effective thermal management solutions are needed at the die level.

Enabling the advances of tomorrow

HENKEL PARTNERS WITH SEMICON SOUTHEAST ASIA 2021

Henkel is pleased to announce that we are the SEMICON South East Asia 2021 sponsor this year.  In this event, Henkel, as the pioneer in adhesives technology, will deliver and showcase our latest in Semi-Sintering paste technology to meet automotive reliability and emerging high-powered electronics.

• To introduce Henkel’s new series of high thermal semi-sintering die attach materials.
• To enable robust package-level sintering and overcome the regulatory challenges of solder, thermal conductivity limitations of traditional die attach materials, and processability complexities of pure sintering pastes.

SEMICON SOUTHEAST ASIA 2021

SEMI Southeast Asia was established in 1993, the same year the SEMICON Singapore exhibition was established. The aim of the SEMI Southeast Asia office is to provide all of the SEMI International Services to the region in a timely manner. If you happen to be visiting or plan to set up operations in Southeast Asia, please contact us at the SEMI Southeast Asia office.

While Southeast Asia is rising up fast as a world-class electronics manufacturing hub with end-to-end R&D capabilities - SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends. Bringing solutions to industry challenges that can best be addressed at the event.  To find out more visit www.semiconsea.org.

HENKEL KEY SPEAKER

The increasing complexity of semiconductor packaging is driving demand for chips with higher reliability. Learn about new materials and process solutions that address these and other manufacturing complexities and semiconductor manufacturing scaling.

HOW CAN I PARTICIPATE?

SEMICON Southeast Asia 2021 Virtual Conference will be held virtually from Singapore 23-27 August 2021. The inaugural 5-day conference in Singapore will focus on the semiconductor industry’s vital role in driving 5G innovation and growth.  The conference will gather industry leaders to share their visions and technology roadmaps and discuss ways to deliver on the promise of this groundbreaking technology across the entire semiconductor value chain.

Event Details
Date/Time: 23 - 27 August 2021 | 08:15 – 17:00 (GMT+8)
Where: SEMICON SEA Virtual 

Henkel Key Speaker
Key Topic: Semi-Sintering Die Attach Paste for Power and High-Frequency Electronics
Key Speaker: Dr Wu Jie
Date/Time: 24 Aug 2021 / Tuesday / 13:15 – 13:45 (GMT+8)T+