BERGQUIST® GAP PAD® TGP HC1000
Poznat kao Gap Pad® HC1000
Elementi i pogodnosti
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material
BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
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Dokumenti i preuzimanja
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Tehnički podaci
| Boja | Siva |
| Jangov modul, ASTM D575 | 275.0 KPa (40.0 psi ) |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.254 - 0.508 mm |
| Tip nosača | Staklena vuna |
| Toplotna provodljivost | 0.1 W/mK |
BERGQUIST® GAP PAD® TGP HC1000
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material