BERGQUIST® GAP PAD® TGP 7000ULM
Elementi i pogodnosti
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
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Dokumenti i preuzimanja
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Tehnički podaci
| Boja | Siva |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.5 - 3.18 mm |
BERGQUIST® GAP PAD® TGP 7000ULM
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).