LOCTITE® ABLESTIK 561KAP
Características e Vantagens
LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
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Documentos e Transferências
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Informação Técnica
| Cronograma de cura, @ 125.0 °C | 2.0 h. |
| Forma física | Película |
| Força de cisalhamento, Alumínio | 1800.0 psi |
| Tipo de cura | Cura de Calor |
| Tipo de operadora | Poliimida |
LOCTITE® ABLESTIK 561KAP
LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film