BERGQUIST® GAP FILLER TGF 3500LVO
Features and Benefits
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This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). Its ultra-conformity and low volatility make it the ideal solution for use in medical electronics and other fragile or low stress assemblies, such as optics and automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components, and will cure at room temperature or faster with the addition of heat.
- Thermal conductivity: 3.5 W/m-K
- 100% solids with no additional cure by-products
- Low volatility for outgassing and silicone sensitive applications
- Ultra-conforming, with excellent wet-out for low stress interface applications
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
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Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 3.5 W/mK |
| Mixed | |
| Color, Mixed | Light blue |
| Resin | |
| Color, Resin | Blue |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 3500LVO
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.