LOCTITE® ABLESTIK 566KAP

Known as Ablestik ABLEFILM 566KAPTON

Features and Benefits

LOCTITE ABLESTIK 566KAP, Epoxy Film, Assembly
LOCTITE® ABLESTIK 566KAP is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion.
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Technical Information

Cure schedule, @ 90.0 °C 3.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 100.0 °C
Physical form Film
Shear strength, Aluminum 300.0 psi
Thermal conductivity 0.2 W/mK