Join us at Medical Fair Asia 2024 to explore Henkel's comprehensive range of medical solutions, including advanced wearable technology and fast-acting light cure adhesives.

Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. Consumer demand for smaller, higher functioning devices presents even greater challenges for thermal management, as these conditions produce higher temperatures and more stress for electronic components. To ensure effective heat management for semiconductor devices, Henkel has developed the Thermal-Clad/Insulated Metal Substrate, which offers a highly-efficient method to cool these devices. Thermal-Clad insulated substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed circuit boards. This information will be presented during the upcoming Henkel webinar, along with details about selection of the application-specific dielectric.

Henkel will explore in this webinar what alternate solution engineers can chose and which dielectric selection is the best for the application.

Author: Michael Stoll...

Automotive electronics' technology continues to find new applications all around the vehicle. Electronic control units are often assembled using Electrically Conductive Adhesives (ECAs), where components are attached to noble metallized ceramic or HDI boards. The major limitation of ECAs has been their instability on common electronic metals, such as tin, which requires the use of expensive noble finished metallizations.

Henkel however, has developed a product that enables stable performance with 100 percent tin-terminated components under several challenging test conditions. Henkel's ECAs provide the benefit of lower processing temperatures compared to solder pastes. This enables bonding of temperature sensitive components to temperature sensitive substrates without damaging them.

Author: Cindy Doumen

A webinar session introducing the new confromal coating solution

Presenting our innovative, sustainable adhesives and coatings for packaging at the drupa 2024 trade fair.