Wirebond Leadframe Solutions
Die attach pastes and films for reliable leadframe devices
Henkel’s l material systems for leadframe-based packaging are focused on providing the highest levels of JEDEC MSL performance, the ability to accommodate increasingly demanding requirements for form factor and bond line control, and optimize electrical and thermal performance. Innovations include tighter particle size control, B-stage and controlled flow adhesives and conductive die attach films that enable multi-chip placement of high power die on a single die pad without increasing package dimensions. For higher power applications, materials with improved in package thermal performance and electrical conductivity approaching that of pure silver have been introduced. And, as copper wire bonds become the standard across the industry, Henkel's non-conductive and conductive die attach paste and film formulations provide Cu compatibility.
