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Henkel Adhesive Technologies
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP 1800
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Electrically insulating, fibreglass-reinforced – exceptional performance
Thermally conductive adhesives
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength activator-cured paste
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 10000ULM
Soft, electrically insulating pad with exceptional thermal conductivity
BERGQUIST® GAP PAD® TGP 1000VOUS
Ultra soft, fibreglass-reinforced insulation pad – high voltage applications
LOCTITE® 384
Thermally conductive adhesive for bonding heat-generating electronic components
BERGQUIST® SIL PAD® TSP 3500
Electrically insulating pad - high performance
BERGQUIST® GAP PAD® TGP HC3000
Soft, fibreglass-reinforced insulation pad for low-stress applications
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid
BERGQUIST® SIL PAD® TSP 1600S
Electrically insulating pad – general purpose
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
