LOCTITE® ABLESTIK 2025DSI
Features and Benefits
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LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 55.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 145.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | -34.0 °C |
| Thermal conductivity | 0.4 W/mK |
| Thixotropic index | 5.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2025DSI
LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach