BERGQUIST GAP PAD TGP 10000ULM
Features and Benefits
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offers high thermal performance at low pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information
| Color | Gray |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 10.0 W/mK |
BERGQUIST GAP PAD TGP 10000ULM
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).