Fixed wireless access helps secure fast and seamless connectivity, particularly in congested areas where offloading traffic from 5G mobile networks can accelerate data rates. Enabling better connections at homes, hospitals, schools, outdoor venues and other locations where capacity and reliability are essential – even into rural areas, Henkel materials are key to the durability and function of fixed wireless access components and devices.
Extending the Power of 5G to Multiple
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Wi-Fi 6 Applications
Wi-Fi 6 Indoor and Outdoor Access Points
Fixed wireless access helps secure fast and seamless connectivity, particularly in solutions that help boost 5G efficiency and better connectivity
Wi-Fi 6 is poised to help solve the challenge of wireless congestion by allowing data offloads through strategically located indoor and outdoor fixed wireless access points. The next-generation of fixed wireless technology enables optimum performance of many devices in a single location and relies on access point component performance to deliver a high bandwidth and low latency broadband connectivity experience to urban and rural communities – whether in the home, office or community venue. With broad applications, Wi-Fi 6 provides better connectivity through fixed network hotspots for retail, education, manufacturing, hospitality and enterprise environments where seamless and secure connection throughout an organization’s physical location is needed. The effectiveness of access points depends largely on the materials used to connect electronics, remove operational heat and secure important components.
Enterprise Wi-Fi 6 Indoor Access Point
enStrain Relief
Henkel’s strain relief provides a convenient local reinforcement for at-risk components. They help devices survive vibration, thermal cycling, and humidity and improve overall component reliability
LOCTITE® ABLESTIK 2151
LOCTITE® 3128
LOCTITE® SI 5210
LOCTITE® SI 5699C
LOCTITE® ECCOBOND EN 3838T
LOCTITE® ECCOBOND EN 3839
TECHNOMELT PA 641
TECHNOMELT PA 7804
GAP PAD®
Low modulus, high conductivity BERGQUIST® GAP PADs provide excellent conformability and low stress thermal performance for IC devices not requiring a larger heat sink attachment.
BERGQUIST GAP PAD® TGP EMI1000(1W/mK)
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3500ULM (3.5W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® 3517M
LOCTITE® ECCOBOND UF 3812
Thread Locker
Trust LOCTITE® threadlockers for superior performance and the reliability you expect. Lock against vibration, shock and thermal cycling – plus seal against corrosion and galling. Achieve better clamp load retention compared to all mechanical locking devices.
LOCTITE® AA 3494
LOCTITE® 661
LOCTITE® 4306
LOCTITE® AA 3525
LOCTITE® 4305
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
BERGQUIST® LIQUI-FORM TLF LF3500 (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF 3800LVO (3.8W/mK)
BERGQUIST® LIQUI-FORM TLF 5800LVO (5.8W/mK)
BERGQUIST® LIQUI-FORM TLF 6000HG (6W/mK)
BERGQUIST® LIQUI-FORM TLF 3500CGEL (3.5W/mK)
BERGQUIST® LIQUI-FORM TLF 4500CGEL SF (4.5W/mK)
Enterprise Wi-Fi 6 Outdoor Access Point
enThread Locker
Trust LOCTITE® threadlockers for superior performance and the reliability you expect. Lock against vibration, shock and thermal cycling – plus seal against corrosion and galling. Achieve better clamp load retention compared to all mechanical locking devices.
LOCTITE® AA 3494
LOCTITE® 243
LOCTITE® 444
Stacking Adhesives
Designed for bonding and enhancing mechanical and structural stability, LOCTITE® staking adhesives offer resistance to multiple fluids, salts, acids and alkalis. Epoxy-based, solvent-free, low-outgassing and non-conductive, staking materials have adhesion compatibility with a wide range of materials for enhanced physical strength and reliability.
LOCTITE® 3128
LOCTITE® ABLESTIK 84-3
LOCTITE® ABLESTIK 724-14C
Thermal Gel
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability and reliability in challenging environments.
BERGQUIST® LIQUI-FORM TLF LF3500
BERGQUIST® LIQUI-FORM TLF 6000HG
BERGQUIST® LIQUI-FORM TLF 3800LVO
BERGQUIST® LIQUI-FORM TLF 5800LVO
BERGQUIST® LIQUI-FORM TLF 3500CGEL
BERGQUIST® LIQUI-FORM TLF 4500CGEL SF
GAP PAD®
Low modulus, high conductivity BERGQUIST GAP PAD® provide excellent conformability and low stress thermal performance for IC devices not requiring a larger heat sink attachment.
BERGQUIST GAP PAD® TGP EMI1000(1W/mK)
BERGQUIST GAP PAD® TGP HC3000 (3W/mK)
BERGQUIST GAP PAD® TGP HC5000 (5W/mK)
BERGQUIST GAP PAD® TGP 3500ULM (3.5W/mK)
BERGQUIST GAP PAD® TGP 6000ULM (6W/mK)
BERGQUIST GAP PAD® TGP 7000ULM (7W/mK)
BERGQUIST GAP PAD® TGP 10000ULM (10W/mK)
BERGQUIST GAP PAD® TGP 12000ULM (12W/mK)
Strain Relief
Henkel’s strain relief provides a convenient local reinforcement for at-risk components. They help devices survive vibration, thermal cycling, and humidity and improve overall component reliability
LOCTITE® ABLESTIK 2151
LOCTITE® 3128
LOCTITE® SI 5210
LOCTITE® SI 5699C
LOCTITE® ECCOBOND EN 3838T
LOCTITE® ECCOBOND EN 3839
TECHNOMELT PA 641
TECHNOMELT PA 7804
Underfill
Underfills offer improved mechanical integrity and reliability for fine-pitch array components.certain IC components. Available in reworkable and non-reworkable formulations, underfills effectively protect component interconnects with low bump heights.
LOCTITE® ECCOBOND UF 1173
LOCTITE® ECCOBOND E 1216M
LOCTITE® 3517M
LOCTITE® ECCOBOND UF 3812
Gasketing
LOCTITE one-component silicone gasketing and sealing products allow for load bearing and shock absorption at the bond location. The materials are designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework in optoelectronics applications.
LOCTITE® 5810F
LOCTITE® SI 5910
LOCTITE® SI 5699
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