LOCTITE® ABLESTIK 2112 BIPAX

Features and Benefits

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LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive
LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.
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Technical Data Sheet
LOCTITE® ABLESTIK 2112 BIPAX
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Technical Information

Cure schedule, Recommended @ 65.0 °C 4.0 hr.
Cure type Heat cure
Number of components 2 part
Recommended for use with Metal
Shear strength, Aluminum 1900.0 psi
Storage temperature 27.0 °C
Thixotropic index 6.5
Viscosity, Brookfield, Spindle RV7, Speed 10 rpm 60000.0 mPa·s (cP)