BERGQUIST® GAP PAD® TGP 7000ULM
Χαρακτηριστικά και οφέλη
A high-performance, thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.
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Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Επιπρόσθετα έγγραφα
Τεχνικές πληροφορίες
| Αξιολόγηση μετάδοσης φλόγας | V-0 |
| Θερμοκρασία λειτουργίας | -60.0 - 200.0 °C |
| Τυπικό πάχος | 0.5 - 3.18 mm |
| Χρώμα | Γκρι |
BERGQUIST® GAP PAD® TGP 7000ULM
A high-performance, thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).