BERGQUIST® GAP PAD® TGP 6000ULM
Χαρακτηριστικά και οφέλη
A high-performance, thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Επιπρόσθετα έγγραφα
Τεχνικές πληροφορίες
| Θερμοκρασία λειτουργίας | -60.0 - 200.0 °C |
| Τυπικό πάχος | 1.524 - 3.175 mm |
| Τύπος μεταφοράς | Υαλοβάμβακας |
| Χρώμα | Γκρι |
BERGQUIST® GAP PAD® TGP 6000ULM
A high-performance, thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).