LOCTITE® ABLESTIK 933-1
Features and Benefits
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant
LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
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Technical Information
| Applications | Encapsulating |
| Cure schedule, @ 125.0 °C | 2.0 hr. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 360500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 933-1
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant