LOCTITE® ECCOBOND F 202
Features and Benefits
LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA
LOCTITE® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its short cure cycle and, for most applications, does not require degassing.
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Technical Information
| Cure schedule, Alternate @ 140.0 °C | 1.0 hr. |
| Cure schedule, Recommended @ 125.0 °C | 2.0 hr. |
| Cure type | Heat cure |
| Number of components | 2 part |
| Operating temperature | -60.0 - 265.0 °C |
| Recommended for use with | Metal |
| Shear strength, Aluminum | 3000.0 psi |
| Storage temperature | 27.0 °C |
| Mixed | |
| Viscosity, Mixed @ 25.0 °C | 1000.0 mPa·s (cP) |
LOCTITE® ECCOBOND F 202
LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA